Groq Reportedly Plans to Apply 3D Stacked DRAM Packaging Technology to Next-Generation Chips

According to media reports, Groq is considering applying 3D stacked DRAM packaging technology to its next-generation chips. This means DRAM would be used to replace the existing SRAM. Industry insiders interpret the move as a bid to substantially increase chip capacity by moving away from the current SRAM-centric chip design. SRAM is fast but has limited capacity, while DRAM is relatively slower but better suited to achieving large-capacity chips. 3D packaging technology stacks multiple semiconductor chips vertically rather than laying them flat, thereby forming a complete chip. Compared with traditional 2D packaging, it can reduce chip surface area and improve energy efficiency.